Kamis, 12 Juli 2007

Cooling


All electronic circuits discharge heat generated by the movement of electrons. As clock frequencies in digital circuits increase, the temperature goes up. Due to the excessive heat produced by overclocked components, an effective cooling system is often necessary to avoid damaging the hardware. In addition, digital circuits slow down at high temperatures due to changes in MOSFET device characteristics. Wire resistance also increases slightly at higher temperatures, contributing to decreased circuit performance.
Because most stock cooling systems are designed for the amount of heat produced during non-overclocked use, overclockers typically turn to more effective cooling solutions, such as powerful fans or heavy duty heatsinks. Size, shape, and material all influence the ability of a heatsink to dissipate heat. Efficient heatsinks are often made entirely of thermally conductive copper, but these are often expensive.[1] Aluminum is more widely used material for heatsinks. Cast iron is the least expensive, but it should be avoided for its poor thermal conductivity. Many good-quality heatsink coolers combine two or more materials to maximize thermal conductivity while minimizing cost.
Water cooling and passive liquid coolant carrying waste heat to a radiator which is similar to an automobile engine's cooling system provide more effective cooling than heatsink and fan combinations when properly implemented, because liquid is denser than air and therefore offers greater thermal transference.
Thermoelectric cooling devices, also known as Peltier devices, are becoming more and more popular these days with the onset of high TDP processors from both Intel and AMD. TEC devices create temperature differences between two plates by running an electric current through said plates. This method of cooling is extremely effective, but is very inefficient, which leads to a lot of excess heat. Because of this, it is necessary to supplement TEC devices with a beefy convection-based heatsink or a water cooling system. Companies like Vigor Gaming offer all-in-one units that combine the advantages of TEC cooling with easy installation. One major drawback of TEC is that they have a large power overhead, sometimes drawing more than 60 W.Other cooling methods are forced convection and phase change cooling which is used in refrigerators. Submersion, liquid nitrogen and dry ice are used as a cooling method in extreme measures, such as record-setting attempts or one-off experiments rather than cooling an everyday system. Submersion method involves sinking a part of computer system directly into a chilled liquid substance that is thermally conductive but sufficiently low in electrical conductivity. The advantage of this technique is that no condensation can form on sensitive electronic components. A good submersion liquid is Fluorinert™ made by 3M, which is expensive and requires a permit to purchase it. Another option is mineral oil, but if it has impurities like water or scenting agents it will conduct electricity.
These extreme methods are generally intolerable in the long term, as they require refilling reservoirs of coolant or are noisy. Moreover, silicon-based MOSFETs will cease to function ("freeze out") below temperatures of roughly 100 K, so using extremely cold coolants may cause devices to cease functioning.(en.wikipedia.org/wiki/Overclocking)

0 komentar: